Memory modules including capacity for additional memory

Details Memory modules including capacity for additional memory Memory modules including capacity for additional memory

2005-01-11

2005-01-11

Wille, Douglas (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

37

Reexamination Certificate

active

06841868

ABSTRACT:
A method and apparatus for repair of a multi-chip module, such as a memory module, are provided where at least one redundant or auxiliary chip attach location is provided on the substrate of the multi-chip module. The auxiliary chip attach location preferably provides contacts for attachment of more than one type of replacement semiconductor chip. Accordingly, when one or more chips on the multi-chip module are found to be completely or partially defective, at least one replacement chip can be selected and attached to the auxiliary location to provide additional memory to bring the module back to its design capacity.

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