Memory modules and methods for manufacturing memory modules

Details Memory modules and methods for manufacturing memory modules Memory modules and methods for manufacturing memory modules

2004-08-26

2009-06-16

Norris, Jeremy C (Department: 2841)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With mating connector which receives panel circuit edge

C174S250000, C439S924100

Reexamination Certificate

active

07547213

ABSTRACT:
Memory modules and methods for manufacturing memory modules are disclosed herein. In one embodiment, a memory module includes a substrate, a microelectronic device carried by the substrate, and a plurality of external contact pads operably coupled to the microelectronic device. The substrate includes a first major surface with a first longitudinal edge and a second longitudinal edge. The external contact pads are disposed on the first major surface proximate to the second longitudinal edge. The contact pads include a first contact pad with a first end proximate to the second longitudinal edge and a second contact pad with a second end proximate to the second longitudinal edge. The first end is spaced apart from the first longitudinal edge by a first distance, and the second end is spaced apart from the first longitudinal edge by a second distance different than the first distance.

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Office Action issued Dec. 12, 2008 in U.S. Appl. No. 11/614,213.

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