Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-05-20
2008-05-20
Dinh, Tuan T. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S760000, C361S748000, C174S260000, C365S051000, C365S063000, C257S678000, C257S723000
Reexamination Certificate
active
11437846
ABSTRACT:
In a first embodiment, the invention provides a memory module having an electronic printed circuit board and a plurality of semiconductor chips of the same type that are mounted on at least one outer face of the printed circuit board. The printed circuit board has a connector strip, which runs at a first edge of the at least one outer face in a first direction and has a multiplicity of electrical contacts that are lined up in the first direction. The printed circuit board extends in the first direction between two opposite second edges. At least nine of the semiconductor chips of the same type are respectively mounted next to one another on the outer face of the printed circuit board between the center of the printed circuit board and the respective second edge of the printed circuit board. The semiconductor chips of the same type respectively have a smaller dimension and, in the direction perpendicular to the smaller dimension, a larger dimension that is larger than the smaller dimension. A respective first group of four of the semiconductor chips of the same type, which are oriented so as to have their shorter dimension parallel to the connector strip, is arranged at the respective second edge of the printed circuit board. A second group of five semiconductor chips of the same type is respectively arranged between the first group of semiconductor chips and the center of the printed circuit board. The first group of semiconductor chips and the second group of semiconductor chips are actuated by two separate line buses whose conductor tracks branch toward all the semiconductor chips in the respective group of semiconductor chips.
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Bacha Abdallah
Muff Simon
RaghuRam Siva
Schuster Josef
Dinh Tuan T.
Infineon - Technologies AG
Levi Dameon E
Slater & Matsil L.L.P.
LandOfFree
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