Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-04-18
2009-06-09
Dinh, Tuan T (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S763000, C361S782000, C361S803000, C365S051000
Reexamination Certificate
active
07545651
ABSTRACT:
A memory module according to one implementation includes a support substrate, plural memory devices mounted on the support substrate, and pins having a predetermined arrangement on the support substrate, the pins comprising signal pins connected to the memory devices, power pins, and ground pins. In the predetermined arrangement of pins, each signal pin uses a ground pin as a reference, and each power pin is adjacent a ground pin for reduced impedance between the power pin and ground pin. In some implementations, some of the signal pins are associated with redundant pins.
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PC2-3200/PC2-4300 DDR2 Registered DIMM Reference Design Specification, Rev. 1.0, pp. 1-45 (Jan. 30, 2003).
PC2-5300/PC2-4200/PC2-3200 Registered DIMM Design Specification, Rev. 2.0 for BOD Ballot (Draft), pp. 1-86 (Oct. 4, 2004).
Day Michael C.
Goodwin June E.
Johnson Brian M.
Nerl John A.
Schumacher Richard A.
Dinh Tuan T
Hewlett--Packard Development Company, L.P.
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