Memory module with a predetermined arrangement of pins

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S763000, C361S782000, C361S803000, C365S051000

Reexamination Certificate

active

07545651

ABSTRACT:
A memory module according to one implementation includes a support substrate, plural memory devices mounted on the support substrate, and pins having a predetermined arrangement on the support substrate, the pins comprising signal pins connected to the memory devices, power pins, and ground pins. In the predetermined arrangement of pins, each signal pin uses a ground pin as a reference, and each power pin is adjacent a ground pin for reduced impedance between the power pin and ground pin. In some implementations, some of the signal pins are associated with redundant pins.

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PC2-5300/PC2-4200/PC2-3200 Registered DIMM Design Specification, Rev. 2.0 for BOD Ballot (Draft), pp. 1-86 (Oct. 4, 2004).

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