Memory module having improved heat dissipation and shielding

Details Memory module having improved heat dissipation and shielding Memory module having improved heat dissipation and shielding

1999-09-15

2001-10-02

Gandhi, Jayprakash N. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S728000, C361S752000, C361S736000, C361S759000, C361S801000, C175S051000

Reexamination Certificate

active

06297966

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates to a memory card module, and particularly to a random access memory (RAM) module having excellent heat dissipation and shielding characteristics.
DESCRIPTION OF THE PRIOR ART
As functional capabilities of a computer continually expand and the amount of data manipulated by the computer also increases, requirements placed on the performance of a memory card module, such as a Dual In-Line Memory Module (DIMM), are becoming more strict. A conventional DIMM is usually inserted into a card edge connector mounted on a mother board. The card edge connector commonly comprises an elongate dielectric housing, a pair of guiding towers vertically and outwardly extending from opposite ends of the housing for guiding the DIMM to electrically connect with the card edge connector, and an ejector mounted on the guiding posts for ejecting the DIMM out of the card edge connector. A latching means is formed on the ejector for securely positioning the DIMM therein, and a plurality of contacts is received in the housing. Each contact comprises a portion for insertion in the corresponding passageway, and a tail portion for being soldered to the mother board to provide electrical communication between the DIMM and related circuitry formed on the mother board.
The DIMM comprises a printed circuit board (PCB), a plurality of memory chips mounted on the PCB, and a plurality of related electronic elements mounted on the PCB. A plurality of golden fingers is formed on opposite sides of a bottom edge of the PCB for electrically engaging the contacts of the card edge connector. A plurality of latching notches or openings is defined at opposite ends of the DIMM for securing with the latching means of the ejector.
However, since memory capability and transmission speed of the memory card module have been greatly increased, problems resulting from heat dissipation and electromagnetic interference adversely affect signal transmission quality. Therefore, an improved RAM bus module having excellent heat dissipation and anti-electromagnetic interference characteristics is requisite.
BRIEF SUMMARY OF THE INVENTION
A main object of the present invention is to provide a RAM bus module having excellent heat dissipation and anti-electromagnetic interference characteristics.
A memory module assembly in accordance with the present invention comprises a memory module, and a pair of shells for enclosing the RAM module. The memory module comprises a printed circuit board (PCB), a plurality of memory chips attached on the PCB and a plurality of related electronic elements disposed near the chips. A securing means comprises a clasp for fixing the PCB and the shells together, and a pair of rivets extending through corresponding positioning apertures defined proximate a bottom edge of the PCB and corresponding apertures defined proximate a bottom edge of the shell. The clasp is resilient and comprises a shoulder and a pair of resilient arms inwardly extending from opposite ends of the shoulder for securing the PCB and the shells together. The clasp can also integrally extend from an upper edge of each shell for being bent to secure the PCB and the shells together after the RAM module is assembled with the shells.
Other objects, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.


REFERENCES:
patent: 5109318 (1992-04-01), Funari et al.
patent: 5309181 (1994-05-01), Ota et al.
patent: 5422790 (1995-06-01), Chen
patent: 5502620 (1996-03-01), Funck et al.

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