Memory module cooling

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S704000, C361S721000, C361S715000, C257S722000, C174S016300, C165S080300

Reexamination Certificate

active

07079396

ABSTRACT:
A heatsink for a memory module includes a substantially planar contact portion for forming a thermal contact with the memory module and for mounting the heatsink on the memory module. One or more formations for emitting heat are also provided, the formations for emitting heat being in thermal communication with the contact portions.

REFERENCES:
patent: 5581442 (1996-12-01), Morosas
patent: 5761041 (1998-06-01), Hassanzadeh et al.
patent: 5966287 (1999-10-01), Lofland et al.
patent: 6025992 (2000-02-01), Dodge et al.
patent: 6031727 (2000-02-01), Duesman et al.
patent: 6119765 (2000-09-01), Lee
patent: 6130820 (2000-10-01), Konstad et al.
patent: 6201695 (2001-03-01), Duesman et al.
patent: 6319756 (2001-11-01), Duesman et al.
patent: 6424532 (2002-07-01), Kawamura
patent: 6449156 (2002-09-01), Han et al.
patent: 6449161 (2002-09-01), Duesman et al.
patent: 6765797 (2004-07-01), Summers et al.
patent: 6775139 (2004-08-01), Hsueh
patent: 6888719 (2005-05-01), Janzen et al.
patent: 6969907 (2005-11-01), Imai et al.
patent: 2005/0201063 (2005-09-01), Lee et al.
patent: 44 27 854 (1995-02-01), None
patent: 203 15 169 (2003-11-01), None
Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority, or the Declaration, International application No. PCT/US2005/019964, Dec. 29, 2005.
International Search Report, International application No. PCT/US2005/019964, Dec. 29, 2005.
Written Opinion of the International Searching Authority, International application No. PCT/US2005/019964, Dec. 29, 2005.

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