Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-07-18
2006-07-18
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S721000, C361S715000, C257S722000, C174S016300, C165S080300
Reexamination Certificate
active
07079396
ABSTRACT:
A heatsink for a memory module includes a substantially planar contact portion for forming a thermal contact with the memory module and for mounting the heatsink on the memory module. One or more formations for emitting heat are also provided, the formations for emitting heat being in thermal communication with the contact portions.
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Gates William George
Harris Richard John
Wrycraft Sean Conor
Chervinsky Boris
Kivlin B. Noäl
Sun Microsystems Inc.
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