Package making – Methods – Filling preformed receptacle and closing
Patent
1995-08-11
1997-04-29
Culver, Horace M.
Package making
Methods
Filling preformed receptacle and closing
53475, B65B 510, B65B 726, B65B 2500
Patent
active
056238134
ABSTRACT:
A container for memory modules comprising a generally rectangular shape with a lid and tray with a multitude of finger-like protrusions forming vertical slots therebetween for receiving memory modules. The interior is formed such that a cavity may be created above and below the memory modules contained inside providing a buffer region, which protects the contents from damage when the exterior of the container is subjected to physical contact.
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patent: 5033253 (1991-07-01), Havens et al.
patent: 5264700 (1993-11-01), Tommasini et al.
Culver Horace M.
MA Laboratories, Inc.
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