Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2005-05-24
2008-08-19
Chambliss, Alonzo (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S786000, C257SE23141, C361S760000, C361S784000, C361S803000, C365S063000
Reexamination Certificate
active
07414312
ABSTRACT:
A memory module substrate printed-circuit board (PCB) has multi-type footprints and an edge connector for mating with a memory module socket on a motherboard. Two or more kinds of dynamic-random-access memory (DRAM) chips with different data I/O widths can be soldered to solder pads around the multi-type footprints. When ×4 DRAM chips with 4 data I/O pins are soldered over the multi-type footprints, the memory module has a rank-select signal that drives chip-select inputs to all DRAM chips. When ×8 DRAM chips with 8 data I/O pins are soldered over the multi-type footprints, the memory module has two rank-select signals. One rank-select drives chip-select inputs to front-side DRAM chips while the second rank-select drives chip-select inputs to back-side DRAM chips. Wiring traces on the PCB cross-over data nibbles between the solder pads and the connector to allow two ×4 chips to drive a byte driven by only one ×8 chip.
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Burlington Mark
Nguyen Henry H. D.
Auvinen Stuart J.
Chambliss Alonzo
gPatent LLC
Kingston Technology Corp.
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