Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-07-13
2008-11-25
Gandhi, Jaypraksh N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S715000, C361S719000, C257S707000, C257S719000
Reexamination Certificate
active
07457122
ABSTRACT:
A memory module assembly includes a printed circuit board (10) having a heat-generating electronic component (14) thereon, and first and second heat-dissipation plates (20), (30) attached on opposite sides of the printed circuit board. The first heat-dissipation plate includes a first hook (24) extending from a side thereof and the first hook includes a resisting portion (242) extending from an end of the first heat-dissipation plate and a first engaging portion (244) extending from a free end of the resisting portion for resisting the printed circuit board and the second heat-dissipation plate. The second heat-dissipation plate defines a depressed portion (34) in a side thereof for engaging with the first hook. The other sides of the first and second heat-dissipation plates engage with each other to clamp the printed circuit board between the first and second heat-dissipation plates.
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Ding Qiao-Li
Lai Cheng-Tien
Zhou Zhi-Yong
Foxconn Technology Co., Ltd.
Fu Zhun Precision Industry (Shen Zhen) Co. Ltd.
Gandhi Jaypraksh N
Niranjan Frank R.
Smith Courtney L
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