Memory module assembly including a clamp for mounting heat...

Details Memory module assembly including a clamp for mounting heat... Memory module assembly including a clamp for mounting heat...

2008-05-20

2008-05-20

Gandhi, Jayprakash (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S715000, C361S719000, C257S707000, C257S719000

Reexamination Certificate

active

11309226

ABSTRACT:
A memory module assembly includes a pair of heat-dissipation plates (10), a printed circuit board (20) sandwiched between the heat-dissipation plates (10), and four clamps (30) for securing the heat-dissipation plates (10) onto opposite sides of the printed circuit board (20). Each clamp includes a connecting portion (32) and a pair of elastic pressing portions (34) extending from opposite free ends of the connecting portion. Each pressing portion has a pair of hooks (342) extending from opposite lateral sides thereof and an engaging portion extending (344) from a free end thereof and clamping on an end of the heat-dissipation plate. The hooks are inserted into openings (18) defined in the heat-dissipation plates and engage with inner surfaces of the heat-dissipation plates.

REFERENCES:
patent: 5966287 (1999-10-01), Lofland et al.
patent: 7221569 (2007-05-01), Tsai
patent: 2003/0026076 (2003-02-01), Wei
patent: 2007/0165382 (2007-07-01), Yu et al.
patent: 2007/0195489 (2007-08-01), Lai et al.
patent: 2007/0263359 (2007-11-01), Lai et al.
patent: 2007/0263360 (2007-11-01), Lai et al.
patent: 2007/0263361 (2007-11-01), Lai et al.

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