Memory module assembly

Details Memory module assembly Memory module assembly

1999-10-25

2001-05-15

Picard, Leo P. (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S702000, C361S717000, C361S719000, C257S713000, C257S719000, C165S080300, C165S165000, C174S015100, C174S016300

Reexamination Certificate

active

06233150

ABSTRACT:

BACKGROUND OF THE INVENTION
The present invention relates to a memory module assembly, and particularly to a memory module assembly having grounding and heat-dissipating functions.
As electronic technology advances, electronic products become increasingly smaller and high speed. For example, a compact memory module can transmit signals at speeds of more than 500 MHz. Heat and electromagnetic interference result from the high speed of signal transmission. Hence, a memory module assembly providing excellent grounding, shielding, and heat transfer effects is required.
BRIEF SUMMARY OF THE INVENTION
A first object of the present invention is to provide a memory module assembly having a heat-dissipating device for rapidly transferring heat therefrom.
A second object of the present invention is to provide a memory module assembly exhibiting excellent shielding effects.
Accordingly, a memory module assembly comprises a memory card having a circuit board and a plurality of electronic components mounted on the circuit board, a pair of shells covering opposite surfaces of the circuit board and a pair of clips securing the card and the shells together. The circuit board forms a grounding pad around three edges thereof. Correspondingly, each shell has a conductive area reliably contacting the grounding pad of the circuit board for preventing electromagnetic interference. The circuit board forms a plurality of openings, and each shell provides a number of projections and apertures corresponding to the openings of the circuit board. The shells are positioned on the card with the projections of one shell received in the openings of the circuit board and the apertures of the other shell. The clips secure the card and the shells together.


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