Memory module

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S764000, C361S765000, C361S749000

Reexamination Certificate

active

07440289

ABSTRACT:
A memory module includes a memory chip MC1disposed at a position opposite to a memory buffer via a module substrate, a memory chip MC3disposed at a position not opposite to the memory buffer via the module substrate, and a memory chip MC11disposed at a position opposite to the memory chip MC3via the module substrate. A branch point at which a wiring part connected to the memory chip MC1and a wiring part connected to the memory chips MC3and MC11are branched is positioned at the memory buffer side from the viewpoint of the intermediate point between the planar mounting position of the memory buffer and the planar mounting position of the memory chips MC3and MC11. Accordingly, the wiring length of the wiring part can be made sufficiently short.

REFERENCES:
patent: 5982654 (1999-11-01), Corisis
patent: 6243272 (2001-06-01), Zeng et al.
patent: 6982893 (2006-01-01), Jakobs
patent: 7102221 (2006-09-01), Miyamoto et al.
patent: 7269025 (2007-09-01), David
patent: 2008/0094811 (2008-04-01), Hazelzet
patent: 2008/0123303 (2008-05-01), Sugano et al.
patent: 2006-268683 (2006-10-01), None

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