Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2005-09-13
2005-09-13
Wilson, Christian (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C438S107000, C438S109000
Reexamination Certificate
active
06943454
ABSTRACT:
A memory module for an electronic system, such as a personal computer or server, includes a double-sided, 184-pin, dual in-line memory module printed circuit board. A plurality of individual electronic components are mounted on both sides of the printed circuit board. Each electronic component includes an electronic component printed circuit board, a first pair of stacked memory dies electrically connected to the electronic component printed circuit board, a second pair of stacked memory dies electrically connected to the electronic component printed circuit board, and a thin small outline ball grid array package at least partially encapsulating the first and second pairs of stacked memory dies. Preferably, an insulator is disposed between each pair of stacked memory dies.
REFERENCES:
patent: 6713854 (2004-03-01), Kledzik et al.
patent: 2003/0112614 (2003-06-01), Tay et al.
patent: 2004/0084771 (2004-05-01), Bolken et al.
Downey Mark
Gulachenski Alan Michael
Khederian Bob
Pirani Gary P.
Kriegsman & Kriegsman
White Electronic Designs Corp.
Wilson Christian
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