Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-07-25
2006-07-25
Bradley, P. Austin (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S161000, C439S487000, C361S704000, C361S710000, C361S719000, C257S719000
Reexamination Certificate
active
07080989
ABSTRACT:
An assembly for a computer system is mountable on a circuit board of a computer system. The assembly includes a base portion for engaging with an electronic component mounted on the circuit board. The assembly also includes a spring formed of memory metal. The spring is operable to urge the base portion against the electronic component to urge the electronic component towards the circuit board. The spring is configured to provide a greater spring force for urging the base portion against the electronic component when the spring is above a predetermined temperature than when it is below said predetermined temperature.
REFERENCES:
patent: 4046442 (1977-09-01), Hutchison
patent: 5010949 (1991-04-01), Dehaine
patent: 5121727 (1992-06-01), Kramer et al.
patent: 5167511 (1992-12-01), Krajewski et al.
patent: 5273441 (1993-12-01), Volz et al.
patent: 6126371 (2000-10-01), McCloskey
patent: 6333772 (2001-12-01), Mori et al.
patent: 6490161 (2002-12-01), Johnson
patent: 6496369 (2002-12-01), Nakamura
patent: 6608752 (2003-08-01), Morris et al.
patent: 6733324 (2004-05-01), Lecsek et al.
patent: 2004/0074630 (2004-04-01), Sen et al.
Notification of Transmittal of the International Search Report, Application No. PCT/US2005/019967 mailed Sep. 28, 2005.
Written Opinion of the International Searching Authority, Application No. PCT/US2005/019967 mailed Sep. 28, 2005.
Bradley P. Austin
Chung-Trans X.
Kivlin B. Noäl
Meyertons Hood Kivlin Kowert & Goetzel P.C.
Sun Microsystems Inc.
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