Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-12-19
2006-12-19
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S701000, C361S719000, C257S715000, C165S080400, C165S104260
Reexamination Certificate
active
07151668
ABSTRACT:
An apparatus is provided for dissipating heat from a semiconductor device that meets dimensional requirements for the semiconductor device and provides enhanced cooling for the semiconductor device. The apparatus provides a relatively large surface area for transferring heat away from a semiconductor device, and provides for enhanced coolant flow through or around the apparatus. The apparatus includes a channel that may accommodate a heat pipe to further enhance transfer of heat away from the semiconductor device.
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Datskovskiy Michael
Holland & Hart LLP
Muskin, Inc.
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