Memory card including stacked semiconductor memory elements loca

Details Memory card including stacked semiconductor memory elements loca Memory card including stacked semiconductor memory elements loca

1993-06-16

1995-05-30

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174260, 174261, 257724, 257777, 361760, 361764, 361772, 361773, 361777, 361807, 361820, H05K 702

Patent

active

054207568

ABSTRACT:
TCP (tape carrier package) type semiconductor memory elements, each having a thickness less than that of the conventional package, are provided on the front and rear surface of a print circuit board in a stacking manner. Close to the semiconductor memory elements stacked, provided are TCP type semiconductor memory elements stacked one on another. Each TCP type semiconductor memory element has outer leads on its one side surface. The outer leads having the same function are arranged in a straight line on the front or rear surface of the print substrate. The outer leads arranged in the straight line are connected with each other via a straight wiring pattern.

REFERENCES:
patent: 4982265 (1991-01-01), Watanabe et al.
patent: 4994896 (1991-02-01), Uemura et al.
patent: 4996583 (1991-02-01), Hatada
Research Disclosure, "Lead Format For First Level Circuit Packages" Oct. 1990 No. 318.

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