Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-05-16
2009-10-27
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE23065, C257SE23176, C257SE23177, C257SE27137, C257SE27144, C257SE27161, C257S679000, C257S685000, C257S688000, C257S692000, C257S723000, C257S730000, C257S777000, C257S778000, C438S121000, C361S749000
Reexamination Certificate
active
07608920
ABSTRACT:
The present invention provides a system and method for employing leaded packaged memory devices in memory cards. Leaded packaged ICs are disposed on one or both sides of a flex circuitry structure to create an IC-populated structure. In a preferred embodiment, leads of constituent leaded IC packages are configured to allow the lower surface of the leaded IC packages to contact respective surfaces of the flex circuitry structure. Contacts for typical embodiments are supported by a rigid portion of the flex circuitry structure and the IC-populated structure is disposed in a casing to provide card structure for the module.
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Entorian Technologies LP
Fish & Richardson P.C.
Williams Alexander O
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