Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate
2007-05-22
2007-05-22
Wong, Don (Department: 2163)
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
C257S679000, C257S676000, C361S757000
Reexamination Certificate
active
11060263
ABSTRACT:
A memory card comprising a circuit board having opposed upper and lower circuit board surfaces, at least one test pad disposed on the upper circuit board surface, and a conductive pattern disposed on the lower circuit board surface and electrically connected to the test pad. Electrically connected to the conductive pattern of the circuit board is a leadframe which includes a plurality of leads, each of the leads having a signal pad portion. At least one electronic circuit element is attached to the lower circuit board surface and electrically connected to the leadframe and to the conductive pattern of the circuit board. A body at least partially encapsulates the circuit board, the leadframe and the electronic circuit element such that the test pad of the circuit board is exposed in an upper body surface of the body, and the signal pad portions of the leads of the leadframe are exposed in a lower body surface of the body.
REFERENCES:
patent: 3668299 (1972-06-01), Mc Neal
patent: 4532419 (1985-07-01), Takeda
patent: 4905124 (1990-02-01), Banjo et al.
patent: 4974120 (1990-11-01), Kodai et al.
patent: 5172214 (1992-12-01), Casto
patent: 5360992 (1994-11-01), Lowrey et al.
patent: 5574309 (1996-11-01), Papapietro et al.
patent: 5742479 (1998-04-01), Asakura
patent: 5753532 (1998-05-01), Sim
patent: 5784259 (1998-07-01), Asakura
patent: 5789280 (1998-08-01), Yokota
patent: 5808359 (1998-09-01), Muto et al.
patent: 5822190 (1998-10-01), Iwasaki
patent: 5893724 (1999-04-01), Chakravorty et al.
patent: 5977613 (1999-11-01), Takata et al.
patent: 6040622 (2000-03-01), Wallace
patent: 6053414 (2000-04-01), Stoll et al.
patent: 6143981 (2000-11-01), Glenn
patent: D445096 (2001-07-01), Wallace
patent: D446525 (2001-08-01), Okamoto et al.
patent: 6376283 (2002-04-01), Chen
patent: 6384472 (2002-05-01), Huang
patent: 6462273 (2002-10-01), Corisis et al.
patent: 6476469 (2002-11-01), Hung et al.
patent: 6545332 (2003-04-01), Huang
patent: 6603196 (2003-08-01), Lee et al.
patent: 6624005 (2003-09-01), Di Caprio et al.
patent: 6911718 (2005-06-01), Alegre et al.
patent: 6965159 (2005-11-01), Miks et al.
patent: 6998702 (2006-02-01), Zwenger et al.
patent: 2002/0140068 (2002-10-01), Lee
patent: 3112688 (1991-05-01), None
patent: 7017175 (1995-01-01), None
patent: 8190615 (1996-07-01), None
patent: 10334205 (1998-12-01), None
patent: 199410938 (1994-05-01), None
patent: 199552621 (1995-12-01), None
Jang Sang Jae
Ko Suk Gu
Lee Choon Heung
Park Chul Woo
Park Sung Su
Amkor Technology Inc.
Stetina Brunda Garred & Brucker
Vy Hung Tran
Wong Don
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