Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1998-06-29
2000-02-22
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 67, H01R 909
Patent
active
060273461
ABSTRACT:
A method and apparatus are described for providing electrical connection between a first array of contact points and a second array of contact points via a layer of anisotropically conductive material in contact with the second array of contact points. A membrane is provided having a plurality of apertures therein for receiving the first array of contact points. A plurality of electrical contacts is also provided, each of the electrical contacts being coupled to the membrane and at least partially in registration with one of the plurality of apertures. The electrical contacts are for contacting the first array of contact points through the plurality of apertures. The electrical contacts are also for electrically connecting to the second array of contact points via the layer of anisotropically conductive material. Each of the electrical contacts is operable to move substantially independently of adjacent electrical contacts.
REFERENCES:
patent: 3596228 (1971-07-01), Reed et al.
patent: 3634807 (1972-01-01), Grobe et al.
patent: 4298436 (1981-11-01), Thomas
patent: 4415403 (1983-11-01), Bakewell
patent: 4707657 (1987-11-01), Boegh-Petersen
patent: 4737112 (1988-04-01), Jin et al.
patent: 4932883 (1990-06-01), Hsia et al.
patent: 5109596 (1992-05-01), Driller et al.
patent: 5118299 (1992-06-01), Burns et al.
patent: 5119111 (1992-06-01), Thomas et al.
patent: 5163834 (1992-11-01), Chapin et al.
patent: 5430614 (1995-07-01), Difrancesco
patent: 5500280 (1996-03-01), Yamazaki et al.
patent: 5632631 (1997-05-01), Fjelstad et al.
patent: 5759047 (1998-06-01), Brodsky et al.
patent: 5785538 (1998-07-01), Beaman et al.
patent: 5812378 (1998-09-01), Fjelstad et al.
patent: 5829988 (1998-11-01), McMillan et al.
patent: 5855063 (1999-01-01), Schreiber et al.
Abstract entitled, "Shaped Elastometric Interposer for Large Area Array Connectors," Research Disclosure, No. 324, Kenneth Mason Publications, Ltd., Apr. 1991, 1 p.
Abstract entitled, "Elastometric Interposer Using Wires in Elastomer Pad with Controlled Compliance, " Research Disclosure, No. 324, Kenneth Mason Publications, Ltd., Apr. 1991, 1 p.
Abstract entitled, "Elastometric Interposer Using Film-Supported Metal Conductors," Research Disclosure, No. 324, Kenneth Mason Publications, Ltd., Apr. 1991, 1 p.
Abstract entitled, "High Density Area Array Connector," Research Disclosure, No. 324, Kenneth Mason Publications, Ltd., Apr. 1991, 1 p.
Abstract entitled, "Method of Testing Chips and Joining Chips to Substrates, " Research Disclosure, No. 322, Kenneth Mason Publications, Ltd., Feb. 1991, 1 p.
Sinsheimer Roger
Teglia Dave
Temer Vladan
Abrams Neil
Hyeon Hae Moon
Xandex, Inc.
LandOfFree
Membrane-supported contactor for semiconductor test does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Membrane-supported contactor for semiconductor test, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Membrane-supported contactor for semiconductor test will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-515985