Member having metallic layer, its manufacturing method and...

Details Member having metallic layer, its manufacturing method and... Member having metallic layer, its manufacturing method and...

2006-04-04

2006-04-04

Sellers, Robert (Department: 1712)

Stock material or miscellaneous articles

Composite

Of polyamide

C174S255000, C174S258000, C174S259000, C428S474400

Reexamination Certificate

active

07022412

ABSTRACT:
A member useful in a printed wiring board comprises a resin insulating layer, a metallic fine particle or catalyst layer, a metal oxide layer, and a metallic or electroless plating layer, wherein the resin insulating layer contains a resin containing an aromatic amide site such as an epoxy-terminated aromatic polyamide.

REFERENCES:
patent: 4413877 (1983-11-01), Suzuki et al.
patent: 5110668 (1992-05-01), Minnick
patent: 5846681 (1998-12-01), Yu et al.
patent: 6426310 (2002-07-01), Kurumatani et al.
patent: 62063683 (1987-03-01), None
patent: 63-276813 (1988-11-01), None
patent: 2-131934 (1990-05-01), None
patent: 6-256960 (1994-09-01), None
patent: 06-256960 (1994-09-01), None
patent: 2622016 (1997-04-01), None
patent: 10-183358 (1998-07-01), None
patent: 11-117060 (1999-04-01), None
patent: 11-220254 (1999-08-01), None
patent: 11-240106 (1999-09-01), None
Machine Translation, JP 06256960, Tumiya et al., Sep. 1994.
English Abstract, JP 02131934, Morita et al., May 1990.
Campbell, Ian M., Introduction to Synthetic Polymers, Oxford University Press, 1994, p. 172.
CAS Structure for poly-p-phenyleneterephthalate.

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