Plastic article or earthenware shaping or treating: apparatus – Female mold and charger to supply fluent stock under... – With means between charger and mold to cut off flow of...
Patent
1997-04-15
1998-08-18
Heitbrink, Tim
Plastic article or earthenware shaping or treating: apparatus
Female mold and charger to supply fluent stock under...
With means between charger and mold to cut off flow of...
2643289, 425564, B29C 4523
Patent
active
057956006
ABSTRACT:
A melt ducting arrangement for an injection molding system having a heated nozzle, a valve pin axially slideable in the heated nozzle and a guide bushing for the valve pin which extends into a manifold and of the heated nozzle. The melt ducting arrangement includes a groove in the heated nozzle extending at least part way around the guide bushing. A melt passage extends between the groove and a melt passage in a manifold. The guide bushing has a hole extending generally axially therethrough. The hole has a narrower diameter portion facing away from the heated nozzle and a wider diameter portion facing into the heated nozzle. The narrower diameter portion slideably receives and guides a valve pin. The wider diameter portion provides space to receive melt between the valve pin and the bushing. Radially spaced openings extend through the bushing and register with the groove and to provide a melt conduit between the bushing and the wider diameter portion of the hole.
REFERENCES:
patent: 4705473 (1987-11-01), Schmidt
patent: 4729733 (1988-03-01), Schmidt
patent: 4917593 (1990-04-01), Gellert
Heitbrink Tim
Tradesco Mold Limited
LandOfFree
Melt ducting arrangement for injection molding nozzle does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Melt ducting arrangement for injection molding nozzle, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Melt ducting arrangement for injection molding nozzle will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1112746