Megasonic cleaning system with buffered cavitation method

Details Megasonic cleaning system with buffered cavitation method Megasonic cleaning system with buffered cavitation method

2006-09-12

2006-09-12

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S001000, C134S031000, C134S034000, C134S042000, C438S906000, C310S311000, C310S316010, C310S317000

Reexamination Certificate

active

07104268

ABSTRACT:
A wafer cleaning method and system including a combined high frequency signal, a low frequency signal, and in one embodiment a biased voltage signal, allows cleaning particles and impurities off of fine-structured wafers, through application of an acoustic field to the wafer through a cleaning liquid which fosters micro-bubble formation for effective cleaning while buffering micro-bubble growth which would otherwise damage the wafer.

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