Medical circuit forming process

Etching a substrate: processes – Forming or treating electrical conductor article

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216 20, B44C 122, C23F 100

Patent

active

055673287

ABSTRACT:
A process to manufacture disposable medical flat flexible printed circuits 10. The process entails depositing conductive metal in the range of 1000 to 2500 Angstroms thick onto a flexible film having a thickness in the range of 0.1 to 10 mils. The first portions of the conductive metal are covered with a resist material arranged in a pattern. Metal circuit material is deposited onto second portions of the conductive metal. Overplating the metal circuit material with a corrosion resistant metal. Lastly, removing the resist material and the first portions of the metal and laminating the circuit.

REFERENCES:
patent: 5041187 (1991-08-01), Hink et al.
patent: 5069215 (1991-12-01), Jadvar et al.
patent: 5109851 (1992-05-01), Jadvar et al.

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