Media for use in plating electronic components

Details Media for use in plating electronic components Media for use in plating electronic components

2007-04-24

2007-04-24

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C205S143000, C205S144000, C205S145000, C205S252000, C205S255000, C205S271000, C205S300000

Reexamination Certificate

active

10463506

ABSTRACT:
Improvements in methods for plating metal on substrates are obtained by providing media in the plating solution in sizes that are less than 60% to 80% smaller than the average dimension of the substrates to be plated. It is also advantageous for the substrates and media to be present in the solution at a volume ratio of above 1/1 to about 5/1. Another embodiment of the invention relates to an apparatus for electroplating a metal deposit on electroplatable substrates.

REFERENCES:
patent: 3242586 (1966-03-01), Peterson
patent: 4272333 (1981-06-01), Scott et al.
patent: 5487824 (1996-01-01), Griego
patent: 5565079 (1996-10-01), Greigo
patent: 6193858 (2001-02-01), Hradil et al.
patent: 6228230 (2001-05-01), Li et al.
patent: 6361676 (2002-03-01), Horie et al.
patent: 2000256899 (2000-09-01), None

Affiliated with

Also associated with

Rating

Media for use in plating electronic components does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Media for use in plating electronic components, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Media for use in plating electronic components will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3764299