Mechanism for removing heat from electronic components

Details Mechanism for removing heat from electronic components Mechanism for removing heat from electronic components

1998-05-19

2000-06-27

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361707, 361710, 361719, 361722, 361728, 361736, 257707, 257726, 165 803, 165185, 174 163, H05K 720

Patent

active

060814241

ABSTRACT:
Heat is removed from electronic components located within a closed housing by the use of a heat-conducting metal clip mounted on the housing cover so as to be in pressure contact with the electronic components. The metal clip includes a U-shaped mounting portion firmly clamped to a clip-mounting wall projecting from the cover, and a series of spring arms extending through a slot opening in the cover into pressure contact with individual electronic components. The clamp force of the clip on the mounting wall is designed to act independently of the pressure exerted by each spring arm on an associated electronic component.

REFERENCES:
patent: D307540 (1990-05-01), McCarthy
patent: D357227 (1995-04-01), Smithers
patent: 3021581 (1962-02-01), Cook et al.
patent: 4669028 (1987-05-01), Faa, Jr.
patent: 5138524 (1992-08-01), Smithers
patent: 5225965 (1993-07-01), Bailey et al.
patent: 5274193 (1993-12-01), Bailey et al.
patent: 5327324 (1994-07-01), Roth
patent: 5343362 (1994-08-01), Solberg
patent: 5461541 (1995-10-01), Wentland et al.

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