Mechanism for removal of surface mount connectors using heat con

Details Mechanism for removal of surface mount connectors using heat con Mechanism for removal of surface mount connectors using heat con

1998-04-17

2000-03-21

Ryan, Patrick

Metal fusion bonding

Process of disassembling bonded surfaces, per se

228 205, 228 51, 228 53, 228125, B23K 1018, B23K 522, B23K 304

Patent

active

06039241&

ABSTRACT:
The inventive mechanism conducts heat through the leads of the connector to the solder connection points, and simultaneously reflows all of the solder on all of the pads. The inventive mechanism comprises a machined aluminum piece that mimics the mating geometry for the connector and couples to the connector as if it were a chip device. The inventive mechanism couples to the connector via heat conducting fins. Heat is transferred to the aluminum piece, and down through the fins and into the internal portion of the connector. The fins contact the internal portion of the connector leads. Thus, heat is transferred from the internal portion of the leads to the exterior portion of the leads, and down to the soldered connection point with the PCB board. Since the fins contact all of the internal leads of the connector, each of the soldered connections is reflowed at approximately the same time, and thus, the connector is then removed from the board.

REFERENCES:
patent: 4238665 (1980-12-01), Tremarco
patent: 4302276 (1981-11-01), Schulze
patent: 4473181 (1984-09-01), Grabow, Jr.
patent: 4506820 (1985-03-01), Brucker
patent: 4518110 (1985-05-01), Breske et al.
patent: 4637542 (1987-01-01), Breske et al.
patent: 4723924 (1988-02-01), Morrison
patent: 4771932 (1988-09-01), Kim
patent: 4979662 (1990-12-01), Kim
patent: 5007574 (1991-04-01), Carlomagno et al.
patent: 5084691 (1992-01-01), Lester et al.
patent: 5093987 (1992-03-01), Scholz
patent: 5147081 (1992-09-01), Kim
patent: 5152448 (1992-10-01), Williams
patent: 5174016 (1992-12-01), Todd
patent: 5240549 (1993-08-01), Hamburgen et al.
patent: 5278393 (1994-01-01), Kim
patent: 5516297 (1996-05-01), Atoh et al.
patent: 5549240 (1996-08-01), Urban

Affiliated with

Also associated with

Rating

Mechanism for removal of surface mount connectors using heat con does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mechanism for removal of surface mount connectors using heat con, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mechanism for removal of surface mount connectors using heat con will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-723638