Geometrical instruments – Gauge – Collocating
Reexamination Certificate
2003-03-05
2004-06-22
Fulton, Christopher W. (Department: 2859)
Geometrical instruments
Gauge
Collocating
C033S613000, C414S935000, C414S940000
Reexamination Certificate
active
06751882
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to a mechanism for positioning a substrate of an image sensor, and in particular to a mechanism for precisely aligning a photosensitive chip with a substrate so as to increase the production yield.
2. Description of the Related Art
Referring to
FIG. 1
, a conventional image sensor includes a substrate
10
, a frame layer
18
, a photosensitive chip
26
, a plurality of wires
28
, and a transparent layer
34
. The substrate
10
has a first surface
12
on which a plurality of signal input terminals
15
is formed, and a second surface
14
on which a plurality of signal output terminals
16
is formed. The frame layer
18
has an upper surface
20
and a lower surface
22
adhered to the first surface
12
of the substrate
10
to form a chamber
24
together with the substrate
10
. The photosensitive chip
26
is arranged within the chamber
24
and is mounted to the first surface
12
of the substrate
10
. Each wire
28
has a first terminal
30
and a second terminal
32
. The first terminals
30
are electrically connected to the photosensitive chip
26
, and the second terminals
32
are electrically connected to the signal input terminals
15
of the substrate
10
. The transparent layer
34
is adhered to the upper surface
20
of the frame layer
18
.
In order to finish the above-mentioned package processes, the substrate
10
has to be precisely positioned and then the frame layer
18
and the photosensitive chip
26
are fixed to a fixed position of the first surface
12
of the substrate
10
. If the substrate
10
is not well positioned, the frame layer
18
and the photosensitive chip
26
cannot be precisely mounted to the substrate
10
. Therefore, the photosensitive chip
26
cannot correctly and completely receive image signals and the quality of the image sensor is influenced.
Referring to
FIG. 2
, a conventional mechanism for positioning a substrate of an image sensor includes a first push-up needle unit
40
, a second push-up needle unit
41
, a first link unit
42
and a second link unit
43
to position a first edge
44
, a second edge
45
, a third edge
46
and a fourth edge
47
of the substrate
10
. The first push-up needle unit
40
is arranged at the first edge
44
of the substrate
10
and has a first link
48
and two first push-up needles
49
to push the first edge
44
of the substrate
10
. The second push-up needle unit
41
is arranged at the second edge
45
of the substrate
10
and has a second link
50
and a second push-up needle
52
to push the second edge
45
of the substrate
10
. The first link unit
42
is arranged at the third edge
46
of the substrate
10
and has a third link
53
and a fourth link
54
pivotally mounted to the third link
53
. A first cam
55
is mounted to a pivotal position between a first end of the fourth link
54
and a first end of the third link
53
in order to push the third edge
46
of the substrate
10
. A second end of the third link
53
and a second end of the fourth link
54
are pivotally mounted to the first link
48
and the second link
50
, respectively. The second link unit
43
is arranged at the fourth edge
47
of the substrate
10
and has a fifth link
56
and a sixth link
57
pivotally mounted to the fifth link
56
. A second cam
58
is mounted to a pivotal position between a first end of the fifth link
56
and a first end of the sixth link
57
in order to push the fourth edge
47
of the substrate
10
. A second end of the fifth link
56
and a second end of the sixth link
57
are pivotally mounted to the first link
48
and the second link
50
, respectively.
As shown in
FIG. 3
, when the positioning mechanism of the invention operates, it moves toward the four edges of the substrate
10
so that the first push-up needles
49
, the second push-up needle
52
, the first cam
55
and the second cam
58
push the first edge
44
, the second edge
45
, the third edge
46
and the fourth edge
47
of the substrate
10
, respectively. Consequently, the substrate
10
is positioned.
Then, it is possible to precisely align the frame layer
18
and the photosensitive chip
26
with the substrate
10
.
However, the first push-up needles
49
, the second push-up needle
52
, the first cam
55
and the second cam
58
are driven toward the four edges of the substrate
10
. At this time, when there are some deviations in the mechanism, the position of the substrate
10
is deviated and the frame layer
18
and the photosensitive chip
26
cannot be precisely aligned with the substrate
10
. Consequently, the photosensitive chip
26
cannot correctly and completely receive image signals and the quality of the image sensor is influenced.
SUMMARY OF THE INVENTION
An object of the invention is to provide a mechanism for positioning a substrate of an image sensor, wherein a photosensitive chip may be precisely aligned with the substrate and the package yield may be improved.
To achieve the above-mentioned object, the invention provides a mechanism for positioning a substrate of an image sensor. The substrate has a first edge, a second edge, a third edge and a fourth edge. The mechanism includes:
a standard unit having a first standard plane and a second standard plane perpendicular and adjacent to the first standard plane, the first standard plane and the second standard plane defining a positioning region in which the substrate is positioned, and the first edge and the second edge adjacent to the first edge contacting the first standard plane and the second standard plane, respectively;
a link unit including a first link and a second link pivotally mounted to the first link at a pivotal portion for positioning the third edge of the substrate; and
a push-up needle unit for positioning the fourth edge of the substrate, wherein when the link unit operates, the push-up needle unit and the pivotal portion of the link unit are moved toward the fourth edge and the third edge of the substrate, respectively, to position the substrate.
According to the above-mentioned mechanism, it is possible to precisely position the substrate so that a flame layer and a photosensitive chip may be precisely mounted to the substrate.
REFERENCES:
patent: 6077026 (2000-06-01), Shultz
patent: 2003/0091291 (2003-05-01), Keo et al.
Huang Jen-Te
Huang Yves
Liu Tanja
Yen Pang-Chieh
Fulton Christopher W.
Guadalupe Yaritza
Kingpak Technology Inc.
Pro-Techtor Inter-national Services
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