Mechanism for exchanging molding dies in an injection molding ma

Details Mechanism for exchanging molding dies in an injection molding ma Mechanism for exchanging molding dies in an injection molding ma

1983-06-20

1984-07-31

Hoag, Willard E.

Plastic article or earthenware shaping or treating: apparatus

With apparatus assembly or dismantling means or with idle part

Plural wear or shaping surfaces mounted for alternative use

100918, 425186, 425190, 425575, B29C 100, B29F 100

Patent

active

044627831

ABSTRACT:
A mechanism for the program-controllable exchange of injection molding dies in the die closing unit of an injection molding machine, comprising a translation table with two die emplacements which are alternatingly movable into transverse alignment with the die clamping space, for horizontal transfer of a die assembly. The transfer movement is produced by a compact roller chain drive with drive pins engaging recesses in a drive rack. The die assemblies have standardized back plates for positioning and guidance of the die assembly by means of aligned guide faces on the translation table and on a guide shelf of the die closing unit. Each die emplacement has a separate drive rack which entrains a die assembly. The drive racks are restrained against movement, when outside the transfer position.

REFERENCES:
patent: 3782874 (1974-01-01), Hehl
patent: 3898030 (1975-08-01), Bishop
patent: 3982869 (1976-09-01), Eggers
patent: 4025268 (1977-05-01), Taylor
patent: 4379685 (1983-04-01), Tada et al.

Affiliated with

Also associated with

Rating

Mechanism for exchanging molding dies in an injection molding ma does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mechanism for exchanging molding dies in an injection molding ma, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mechanism for exchanging molding dies in an injection molding ma will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-183840