Mechanism for connecting printed circuit boards of separate devi

Details Mechanism for connecting printed circuit boards of separate devi Mechanism for connecting printed circuit boards of separate devi

1998-06-29

2000-03-14

Luebke, Renee S.

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439 74, 439928, 800729, H01R 909

Patent

active

060365056

ABSTRACT:
The mechanism establishes electrical connection of two printed circuit boards of separate devices that form individual modules within a stackable module system. In order to achieve a simply constructed connection mechanism, the printed circuit boards respectively have centering or spring clips into which an adapter assembly is pluggable. The adapter assembly is thereby composed of two blade or spring clips firmly connected to one another via an adapter assembly printed circuit board, whereby the adapter assembly is surrounded by shielding covers firmly connected to one another. In the plugged condition, the adapter assemblies are conducted through housing openings in oppositely residing housing parts of the devices stacked above one another, whereby the outsides of the shielding covers contact the surrounding edges of the housing openings.

REFERENCES:
patent: 5536774 (1996-07-01), Tan et al.
patent: 5645434 (1997-07-01), Leung
patent: 5730607 (1998-03-01), Darty
patent: 5768106 (1998-06-01), Ichimura
patent: 5838548 (1998-11-01), Matz et al.

Affiliated with

Also associated with

Rating

Mechanism for connecting printed circuit boards of separate devi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mechanism for connecting printed circuit boards of separate devi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mechanism for connecting printed circuit boards of separate devi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-163462