Mechanism and method for moving tool or the like

Metal fusion bonding – Means to bond by applying only pressure

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214 1BT, 214650SG, 228 6A, 228 49, B23K 3704

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active

040196682

ABSTRACT:
A tool for transfering a semiconductor die from one location to the other is mounted in a holder comprised of a shaft which is normally horizontally disposed and extends forwardly from a plate which moves up and down so that the tool can be raised and lowered. The shaft also moves longitudinally through the plate so that the tool can be moved fore and aft. A first lever driven by a cam rotated by a first motor causes the plate to move downwardly and first bias means urges the plate in an upward direction. A second lever is pivoted in a vertical plane and is coupled to a rotatable member driven by a second motor. The lever shifts the shaft fore and aft, and second bias means urges the shaft toward the lever. In a second embodiment, the first lever is omitted and a handle and linkage is substituted therefor for manual up and down control of the shaft.

REFERENCES:
patent: 2713426 (1955-07-01), Drew
patent: 2925612 (1960-02-01), Schramm
patent: 3039623 (1962-06-01), Sehn et al.
patent: 3479716 (1969-11-01), Zanger, Jr. et al.
patent: 3501026 (1970-03-01), Kamila et al.
patent: 3762015 (1973-10-01), Radobenko
patent: 3850315 (1974-11-01), Plaister et al.
patent: 3865253 (1975-02-01), Healy

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