Mechanically restricted laser deposition

Details Mechanically restricted laser deposition Mechanically restricted laser deposition

1998-03-31

2000-05-09

Meeks, Timothy

Coating processes

Direct application of electrical, magnetic, wave, or...

Electrostatic charge, field, or force utilized

427531, 427586, 427596, 427597, 427256, H05B 700

Patent

active

060601272

ABSTRACT:
An apparatus for metal line deposition and a method for metal line deposition using the apparatus. A donor plate has a donor substrate transparent to a focused coherent light beam and a donor surface. The donor surface of the donor plate has a channel formed therein. The channel is coated with a metallic material. A deposition substrate onto which the metal line is to be deposited is disposed adjacent the donor surface of the donor plate. The focused coherent light beam is directed through the donor substrate of the donor plate and onto the metallic coating in the channel. The focused coherent light beam causes the metallic material to ablate from the channel by discharging ions of the metallic material away from the channel and onto the deposition substrate to form the metal line.

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