Mechanically reconfigurable vertical tester interface for IC...

Details Mechanically reconfigurable vertical tester interface for IC... Mechanically reconfigurable vertical tester interface for IC...

2007-06-12

2007-06-12

Abrams, Neil (Department: 2839)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

10868425

ABSTRACT:
A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, and unpluggable using pins, enabling movement over a range of positions.

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