Mechanically enhanced package and method of making same

Details Mechanically enhanced package and method of making same Mechanically enhanced package and method of making same

2005-05-17

2005-05-17

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C257S787000, C257S796000, C438S127000, C029S841000

Reexamination Certificate

active

06894229

ABSTRACT:
An electronic package comprises a substrate, an electronic device mounted on the substrate, and a stiffener having a central hole on top of the electronic device. The electronic device has bond pads connected to the respective bond fingers on the substrate by bond wires. The stiffener and the substrate together define a space that houses the chip and the bond wires. A molding compound fills the space and covers the stiffener. A method of forming the electronic package comprises: providing the substrate; bonding the electronic device to the substrate; placing a stiffener on the substrate so that the stiffener and the substrate define a space for housing the electronic device; and injecting a molding compound into a central hole of the stiffener, the molding compound filling the space and overflowing out of the hole to cover the stiffener.

REFERENCES:
patent: 6046077 (2000-04-01), Baba
patent: 6191360 (2001-02-01), Tao et al.
patent: 6246015 (2001-06-01), Kim
patent: 6433420 (2002-08-01), Yang et al.
patent: 6570259 (2003-05-01), Alcoe et al.
patent: 6654248 (2003-11-01), Fishley et al.

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