Mechanically enhanced, high impact strength triazine resins, and

Details Mechanically enhanced, high impact strength triazine resins, and Mechanically enhanced, high impact strength triazine resins, and

1992-03-10

1993-10-05

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428327, 4284111, 428901, 174250, 361748, B32B 300

Patent

active

052503470

ABSTRACT:
Disclosed are filled poly(triazine) resin dielectrics and microelectronic circuit packages incorporating them. In the filled poly (triazine) dielectric composites, dispersed thermoplastic polymeric fillers are used to reduce the brittleness and increase the ductility of the triazine polymer, while preserving the low dielectric constant of the triazine host matrix-based composite.

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patent: 4740584 (1988-04-01), Shimp
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patent: 4784901 (1988-11-01), Hatakeyama et al.
patent: 4970276 (1990-11-01), Das et al.
patent: 5089660 (1992-02-01), Murray et al.
patent: 5108825 (1992-04-01), Wojnarowski et al.
patent: 5206074 (1993-04-01), Davis et al.
Principles of Electronic Packaging p. 351 edited by Donald P. Seraphim et al. (1989).
Printed Circuits Handbook 3rd ed. chapter 32.2 edited by Clyde F. Coombs, Jr. (1988).

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