Mechanically assisted evaporator surface

Details Mechanically assisted evaporator surface Mechanically assisted evaporator surface

1980-12-24

1982-10-05

Davis, Jr., Albert W.

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

16510426, 165DIG11, 16510433, 62514R, 62119, F28D 1500

Patent

active

043523927

ABSTRACT:
A mechanically assisted evaporator layer for use in both open and evacuated heat transfer systems, in which a pump and spray nozzle operate in conjunction with a sintered metal evaporator layer to reduce the temperature difference required to transfer heat across the thickness of the surface and to permit smaller temperature differences and higher power densities in transferring heat. Liquid is pumped to and sprayed from a nozzle onto the sintered metal layer to keep the entire surface wetted at all times so as to permit uniform thin film evaporation from the surface. The continual presence of liquid at the outer evaporative boundary reduces the likelihood of surface dryout while the thermal conductivity of the sintered metal promotes more effective vaporization.

REFERENCES:
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patent: 2901893 (1959-09-01), Saltzman
patent: 3095255 (1963-06-01), Smith
patent: 3838997 (1974-10-01), Becker et al.
patent: 3842596 (1974-10-01), Gray
patent: 3852806 (1974-12-01), Corman et al.
patent: 3989095 (1976-11-01), Voboril et al.
patent: 3999400 (1976-12-01), Gray
Hwang et al., U. P. Evaporation Cooling Module, IBM Tech. Discl. Bulletin, vol. 21, No. 10, 3/79.
Sachar, K. S. Integrated Circuit Cooling Device, IBM Tech. Discl. Bulletin, vol. 19, No. 2, 7/76.
Bahelaar et al., E. J. Heat Pipe for Chip Cooling, IBM Tech. Discl. Bulletin, vol. 14, No. 9, 2_72.
R. A. Freggens, in "Experimental Determination of Wick Properties for Heat Pipe Applications", 4th IECEC, Washington, D.C., Sep. 1969.

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