Mechanical translator for semiconductor chips

Details Mechanical translator for semiconductor chips Mechanical translator for semiconductor chips

1990-03-22

1991-10-29

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 80, 357 65, 361409, 361413, H02B 100, H01L 2500

Patent

active

050619896

ABSTRACT:
Disclosed herein is a mechanical translator for use in replacing one semiconductor chip with another. A translator allows a first semiconductor chip to be replaced with second semiconductor chip. The translator includes a module having a first surface with a plurality of pins in a first pattern that is compatible with the contact pins of the first semiconductor chip and having a plurality of electrically conductive pads in a second pattern that is compatible with the contact pins of the second semiconductor. The module includes translating semiconductor logic for translating the electrical signals designed to be supplied to and received from the first second semiconductor chip to be compatible with the electronic signals supplied to and received from the second semiconductor chip. The electrical pads are appropriately connected to the translating logic. Also included is an adapter having pattern of pins and sockets compatible with the pattern of pins and sockets of the replacing semiconductor chip. The adapter is connectable in piggy back fashion with the module.

REFERENCES:
patent: 4774630 (1988-09-01), Reisman et al.
"Mated Array Chip Configuration", IBM TDB, vol. 28, No. 2, 7/85, pp. 811-812.
"Semiconductor Packaging Using Chip Mate", IBM TDB, vol. 27, No. 11, Apr./85, pp. 6507-6508.

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