Mechanical shock and impact resistant ceramic semiconductor pack

Details Mechanical shock and impact resistant ceramic semiconductor pack Mechanical shock and impact resistant ceramic semiconductor pack

1980-08-18

1982-10-26

Dixson, Jr., William T.

Special receptacle or package

For a vehicle

206593, 174 52PE, 357 72, 357 74, 357 80, 29588, B65D 8530, H05F 302, H05K 500, H05K 300

Patent

active

043557198

ABSTRACT:
A mechanical shock and impact resistant ceramic semiconductor package is formed by applying a resilient, non-conductive, non-absorbent, heat-resistant material onto the surfaces of said package. In a dual in-line ceramic package a silicone polymer is discretely applied onto at least one end of the longitudinally opposite end edge surfaces. This renders the package mechanical shock and impact resistant.

REFERENCES:
patent: 2939058 (1960-05-01), Masterson
patent: 2951612 (1960-09-01), Salzenbrodt
patent: 3435949 (1969-04-01), Suverkropp
patent: 3489845 (1970-01-01), Landron
patent: 3617819 (1971-12-01), Boisvert et al.
patent: 3735209 (1973-05-01), Saddler
patent: 3793474 (1974-02-01), Dunn et al.
patent: 3877065 (1975-04-01), Vladik
patent: 4037267 (1977-07-01), Klsor
patent: 4107555 (1978-08-01), Haas et al.
patent: 4171049 (1979-10-01), Nohara et al.

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