Mechanical pulse reflow bonding process

Details Mechanical pulse reflow bonding process Mechanical pulse reflow bonding process

1980-01-18

1981-11-17

Weidenfeld, Gil

Metal fusion bonding

Process

Plural joints

228212, 228222, 219 85D, B23K 112, H01L 21603

Patent

active

043007155

ABSTRACT:
An assembly system for assembling microcomponents of semi-conductor or other electronic devices includes on a unitary machine frame the tooling for precision excising tape mounted microcomponents, precision forming their electrical leads, placement of the components in correct registration with conductors on a pre-positioned substrate, and bonding the formed leads to the conductors. Bonding is conducted by clamping the leads to the conductors at the bond site, moving a heated anvil into contact with a heat conductive path to the bond site and withdrawing the heated anvil while maintaining the clamping.

REFERENCES:
patent: 2274413 (1942-02-01), Ingerson
patent: 3230338 (1966-01-01), Kawecki
patent: 3282564 (1968-05-01), Gallentine
patent: 3589591 (1971-06-01), Schwenn
patent: 3791018 (1974-02-01), Johnston et al.
patent: 3937388 (1976-02-01), Zimmerman

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