Mechanical property measurement of thin films by micro...

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – By loading of specimen

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C073S790000, C073S791000, C073S795000

Reexamination Certificate

active

07395722

ABSTRACT:
This invention is directed to the measurement of stress-strain relationships in thin films using substantially flat, parallel test surfaces with minimal width. This invention is further directed to the measurement of stress-strain relationships in thin films at controlled temperatures and at high strain rates above 100% per second.

REFERENCES:
patent: 4140008 (1979-02-01), Golembeck et al.
patent: 5074983 (1991-12-01), Eltoukhy et al.
patent: 5255562 (1993-10-01), Yamamoto et al.
patent: 5299450 (1994-04-01), Nakagawa et al.
patent: 5377289 (1994-12-01), Johnson et al.
patent: 5517860 (1996-05-01), Lin et al.
patent: 6050138 (2000-04-01), Lynch et al.
patent: 6321594 (2001-11-01), Brown et al.
patent: 6393898 (2002-05-01), Hajduk et al.
patent: 6520004 (2003-02-01), Lin
patent: 6679130 (2004-01-01), Hajduk et al.
patent: 6736017 (2004-05-01), Mansky
patent: 7112443 (2006-09-01), Hajduk et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Mechanical property measurement of thin films by micro... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mechanical property measurement of thin films by micro..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mechanical property measurement of thin films by micro... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2806088

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.