Mechanical press machine for forming semiconductor packages

Details Mechanical press machine for forming semiconductor packages Mechanical press machine for forming semiconductor packages

1997-08-25

1999-03-09

Larson, Lowell A.

Wireworking

Crimping

72 4, B21F 4500

Patent

active

058787895

ABSTRACT:
The present invention relates to a press for trimming and forming lead frames of semiconductor packages which have been molded in order to form individual semiconductor chips. The press machine for forming semiconductor packages according to the present invention is able to perform punching operation at low noise and high speed by vertically moving the upper mold mounted on an movable plate through a crank mechanism which is operated by a servomotor and has a characteristic of performing accelerated and decelerated motion with rotation, and also able to drive a feeding device by using the power of the servomotor which drives the press device, without using other driving source. And when there is caused such a trouble that a lead frame gets off the correct position, punching operation is interrupted to prevent any damage on semiconductor packages and a mold by lifting the movable plate provided with an upper mold. The measure can be performed with ease by the feeding finger lifting device for lifting the feeding finger in such a case.

REFERENCES:
patent: 3367168 (1968-02-01), McHenry et al.
patent: 5443101 (1995-08-01), Fierkens

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