Mechanical plating process

Details Mechanical plating process Mechanical plating process

1978-10-03

1980-05-13

Kendall, Ralph S.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 11, 427127, 427192, 427292, 427328, 427445, 118 76, 118244, 118259, C23C 1700

Patent

active

042029155

ABSTRACT:
A mechanical plating process in which a work piece is plated without the necessity of tumbling the work piece in a barrel. A plating member having a plurality of plating elements is positioned with the plating elements adjacent a surface to be plated. Void spaces between the plating elements form reservoirs for liquid plating medium, containing a carrier liquid and plating metal particles. The liquid plating medium is supplied to the work area and to the reservoirs formed by the void spaces. A mechanical plating layer is formed by the plating metal particles by moving the plating member over the work surface with the plating elements, such as bronze wire elements, urged against the work surface. Additional plating medium is supplied to the work area and to the reservoirs during the plating operation to build up an adherent, mechanically applied, metal coating. The plated metal particles are preferably supplied to the work zone in flocculated form.

REFERENCES:
patent: 3132043 (1964-05-01), Clayton
patent: 3700505 (1972-10-01), Kanter

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