Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices
Reexamination Certificate
2007-04-30
2009-08-18
Budd, Mark (Department: 2834)
Electrical generator or motor structure
Non-dynamoelectric
Piezoelectric elements and devices
C310S344000
Reexamination Certificate
active
07576470
ABSTRACT:
A method and apparatus, wherein a die is attached to a supporting base structure utilizing a rigid bond adhesive for a SAW (Surface Acoustic Wave) sensor. A rigid bond adhesive with a preferably high glass transition temperature (Tg) can be applied directly between the die and the die supporting structure in a pattern to eliminate time dependent gradual stress effects upon SAW sensor. The rigid bond adhesive can then be cured, which results in a high yield strength and a high young's modulus. The supporting base and the die material comprise a same co-efficient of thermal expansion in order to avoid die displacement over temperature.
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Wafer Backside Coating of Die Attach Adhesives; T. Winster, C. Borkowski, Ablestik, Rancho Dominguez, CA; A. Hobby, DEK Printing Machines, Weymouth, Dorset, UK Oct. 1, 2006.
Avramescu Viorel V.
Cook James D.
Kumar Sachin
Marsh Brian J.
O'Brien Gary
Budd Mark
Honeywell International , Inc.
Kaasch Tuesday A.
Lopez Kermit D.
Ortiz Luis M.
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