Mechanical locking between multi-layer printed wiring board cond

Details Mechanical locking between multi-layer printed wiring board cond Mechanical locking between multi-layer printed wiring board cond

1984-10-02

1986-12-16

Kucia, R. R.

Metal working

Method of mechanical manufacture

Electrical device making

29847, 29852, 156153, 174 685, 264139, 264156, 264273, 361414, H05K 342, H05K 346

Patent

active

046285989

ABSTRACT:
A plated through-hole conductor structure for a multiple layer laminate electronic printed wiring board includes mechanical locking of the plated through conductor with textured conductor surfaces together with use of etching or other processing to provide laminate internal space for the mechanical locking structure. A manufacturing sequence and plural material selections are also disclosed.

REFERENCES:
patent: 2872391 (1959-02-01), Hauser
patent: 3264402 (1966-08-01), Shaheen et al.
patent: 3301939 (1968-01-01), Krasnow
patent: 3411204 (1968-11-01), Reid
patent: 3471631 (1969-10-01), Quintama
patent: 3627902 (1971-12-01), Meyres et al.
patent: 3660726 (1972-05-01), Ammon et al.
patent: 3809591 (1974-05-01), Vogelfanger et al.
patent: 4012307 (1977-03-01), Phillips
patent: 4091125 (1978-05-01), Delgadillo
patent: 4354895 (1982-10-01), Ellis

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