Mechanical highly compliant thermal interface pad

Details Mechanical highly compliant thermal interface pad Mechanical highly compliant thermal interface pad

2005-06-28

2005-06-28

Leo, Leonard R. (Department: 3753)

Metal working

Method of mechanical manufacture

Heat exchanger or boiler making

C165S081000, C165S185000, C257S718000, C361S704000

Reexamination Certificate

active

06910271

ABSTRACT:
A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configured such that the completed thermal interface pad includes a plurality of spring members on at least two sides of the pad. The thermal interface plate assemblies are configured to allow the thermal interface pad to vary greatly in thickness. The pad is sufficiently adjustable in thickness to accommodate gross tolerance differences between multiple heat generating and sinking devices. Rods inserted in openings in the plates may be used to align the plate assemblies and to apply compressive force to the plates, improving the thermal conductivity between adjacent plates and greatly decreasing the overall thermal resistance of the thermal interface pad.

REFERENCES:
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patent: 4498530 (1985-02-01), Lipschutz
patent: 4535841 (1985-08-01), Kok
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patent: 5201866 (1993-04-01), Mok
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patent: 5705850 (1998-01-01), Ashiwake et al.
patent: RE35721 (1998-02-01), Daikoku et al.
patent: 5751062 (1998-05-01), Daikoku et al.

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