Mechanical heat sink attachment having two pin headers and a spr

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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245981, 24626, 248510, 257719, 361704, H05K 720

Patent

active

057345562

ABSTRACT:
An assembly for clamping a heat sink to an integrated circuit package that is mounted to printed circuit board. The assembly includes a pair of pin headers that are mounted to the printed circuit board. The assembly also contains a clip that is snapped onto the pin headers and presses the heat sink into the package. The pin headers each have a pair of posts that extend from a spacer. The posts are soldered to the printed circuit board to secure the headers to the board. The headers also have wire loops that extend from the spacers and capture the ends of the clip.

REFERENCES:
patent: 3946276 (1976-03-01), Braun
patent: 4679118 (1987-07-01), Johnson
patent: 4716494 (1987-12-01), Bright
patent: 5371652 (1994-12-01), Clemens
patent: 5521439 (1996-05-01), Casati
patent: 5581442 (1996-12-01), Morosas
patent: 5640305 (1997-06-01), Smithers

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