Mechanical heat sink attachment

Details Mechanical heat sink attachment Mechanical heat sink attachment

1996-06-25

1998-06-02

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

248510, 257719, 267158, 361719, H05K 720

Patent

active

057610410

ABSTRACT:
A leaf type spring is used to hold a heat sink in contact with a chip or other heat-emitting component. Such a component may be mounted on a PCB or other element. A bolster plate is positioned below the PCB and two pins extend up from the bolster plate, through the PCB and through the base of a heat sink. A preferred heat sink has plural fins extending up from the base. In one form of the invention the pins extend above the level of the outer ends of the pins. A spring extends diagonally across the ends of the fins. Slots in the ends of the spring engage necks formed near the ends of the pins. In another form of the invention the fins are milled or otherwise formed with a groove extending diagonally across the heat sink and the spring fits into the slot. The pins extend only a short distance above the base of the heat sink and are necked to receive the slotted ends of the spring. In both forms of the invention intimate contact of the base with the heat emitting component improves heat transfer.

REFERENCES:
patent: 5019940 (1991-05-01), Clemens
patent: 5371652 (1994-12-01), Clemens
patent: 5384940 (1995-01-01), Soule
patent: 5504652 (1996-04-01), Foster
patent: 5541811 (1996-07-01), Henningsson
patent: 5570271 (1996-10-01), Lavochkin
patent: 5600540 (1997-02-01), Blomquist
patent: 5602719 (1997-02-01), Kinion
patent: 5621615 (1997-04-01), Dawson

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