Mechanical force sensing semiconductor device

Measuring and testing – Speed – velocity – or acceleration – Acceleration determination utilizing inertial element

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

7351416, 3612833, G01P 15125

Patent

active

056273185

ABSTRACT:
A semiconductor mechanical sensor having a new structure in which a S/N ratio is improved. In the central portion of a silicon substrate 1, a recess portion 2 is formed which includes a beam structure. A weight is formed at the tip of the beam, and in the bottom surface of the weight in the bottom surface of the recess portion 2 facing the same, an electrode 5 is formed. An alternating current electric power is applied between the weight portion 4 and the electrode 5 so that static electricity is created and the weight is excited by the static electricity. In an axial direction which is perpendicular to the direction of the excitation of the weight, an electrode 6 is disposed to face one surface of the weight and a wall surface of the substrate which faces the same. A change in a capacitance between the facing electrodes is electrically detected, and therefore, a change in a physical force acting in the same direction is detected.

REFERENCES:
patent: 4483194 (1984-11-01), Rudolf
patent: 4574327 (1986-03-01), Wilner
patent: 4598585 (1986-07-01), Boxenhorn
patent: 4609968 (1986-09-01), Wilner
patent: 4653326 (1987-03-01), Danel et al.
patent: 4679434 (1987-07-01), Stewart
patent: 4711128 (1987-12-01), Boura
patent: 4744248 (1988-05-01), Stewart
patent: 4744249 (1988-05-01), Stewart
patent: 4783237 (1988-11-01), Aine et al.
patent: 4891984 (1990-01-01), Fujii et al.
patent: 4922756 (1990-05-01), Henrion
patent: 5016072 (1991-05-01), Greiff
patent: 5095752 (1992-03-01), Suzuki et al.
patent: 5151763 (1992-09-01), Marek et al.
patent: 5243861 (1993-09-01), Kloeck et al.
patent: 5277053 (1994-01-01), McLane et al.
patent: 5313836 (1994-05-01), Fujii
patent: 5335544 (1994-08-01), Wagner et al.
patent: 5417312 (1995-05-01), Tsuchitani et al.
Richard S. Payne et al, "Surface Micromachined Accelerometer: A Technology Update", SAE International, Feb. 25, 1991, pp. 127-135.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Mechanical force sensing semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mechanical force sensing semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mechanical force sensing semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2133955

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.