Mechanical cooling fin for interconnects

Details Mechanical cooling fin for interconnects Mechanical cooling fin for interconnects

2006-04-18

2006-04-18

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S719000, C361S722000, C257S713000

Reexamination Certificate

active

07031163

ABSTRACT:
In one embodiment, an integrated circuit includes an electrically active interconnect line within a dielectric layer having a top and bottom surface, the bottom surface of the dielectric layer being coupled to the top surface of a substrate underlying the dielectric layer. The dielectric layer has horizontally arranged heat dissipating layers. An electrically inactive conductor or cooling fin is located within the dielectric layer at a heat dissipating layer below and closer to the substrate than said active interconnect line. The electrically inactive conductor is coupled to said electrically active interconnect line as an extensions of electrically active interconnect line to dissipate heat therefrom.

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