Mechanical bonding of surface conductive layers

Details Mechanical bonding of surface conductive layers Mechanical bonding of surface conductive layers

1978-11-15

1982-03-16

Weidenfeld, Gil

Metal fusion bonding

Process

Using high frequency vibratory energy

228 31, 228 441A, 228116, 228173C, 228180R, 228219, 29853, B23K 2002, B23K 2010, B23K 2014

Patent

active

043197086

ABSTRACT:
An electrically conductive path through an insulating plate (10) is produced by forcing sheets of conductive material (13, 14) into contact through a hole (11) in the plate (10). The sheets (13, 14) are forced together with sufficient force to produce a cold weld junction, which is then plated with a conductive metal (102). Dies for producing the cold weld utilize metallic spheres (110), rods (188) or chemically etched projections (228). Shaped dies (268, 272) form a crimped joint without a cold weld, and offset dies (246, 250) produce a raised junction (252) for use as a mount for a planar component. In manufacturing a printed circuit board (160) the cold weld die (158) is produced with the same drill hole pattern as used to form the drill holes in the printed circuit board (160).

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