Metal fusion bonding – Process – Using explosive energy
Patent
1984-04-16
1986-12-09
Ramsey, Kenneth J.
Metal fusion bonding
Process
Using explosive energy
228265, 228180A, 219121LD, 219 95, 29853, B23K 2006
Patent
active
046275657
ABSTRACT:
An electrically conductive path through an insulating plate (10) is produced by forcing sheets of conductive material (13, 14) into contact through a hole (11) in the plate (10). The sheets (13, 14) are forced together with sufficient force to produce a cold weld junction, which is then plated with a conductive metal (102). Dies for producing the cold weld utilize metallic spheres (110), rods (188) or chemically etched projections (228). Shaped dies (268, 272) form a crimped joint without a cold weld, and offset dies (246, 250) produce a raised junction (252) for use as a mount for a planar component. In manufacturing a printed circuit board (160) the cold weld die (158) is produced with the same drill hole pattern as used to form the drill holes in the printed circuit board (160).
A force sufficient to cause metalurgical bonding of the opposed conductors may also be applied by an explosive discharge. A hole in the junction area of the opposed conductors may be created or enlarged by the use of a laser beam. Opposing conductive foils on either side of a hole in a dielectric material may also be joined by fusing with a laser beam.
REFERENCES:
patent: 2889393 (1959-06-01), Berger
patent: 2925645 (1960-02-01), Bell et al.
patent: 2974284 (1961-03-01), Parker
patent: 3037265 (1962-06-01), Kollmeier
patent: 3315133 (1967-04-01), Walker
patent: 3354543 (1967-11-01), Lawrence et al.
patent: 3531852 (1970-10-01), Slemmons et al.
patent: 3557983 (1971-01-01), Hayes et al.
patent: 3562009 (1971-02-01), Cranston et al.
patent: 3680209 (1972-08-01), Hacke
patent: 3998374 (1976-12-01), Cranston et al.
patent: 4319708 (1982-03-01), Lomerson
patent: 4341942 (1982-07-01), Chaudhari et al.
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